Dongguan Kingfei Technology Co.,Limited
Professional Supplier Of SMT Spare Part , as Feeder, Nozzle, Filter, Motor, Laser, etc.
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Specialized equipment for transparent glue inspection SMT Equipment AOI
Method for detecting underfill on devices
A:Chip thickness Excessive glue layer height::
B:Excessive glue layer height
Min:Should not be lower than the bottom
Max:Should not exceed the upper surface of the chip
Recommended height is 2/3 of the chip height
Glue filling quantity.
The smaller wide-spacing of CSP the higher filling arc required The large the wide-spacing of csp,the smaller filling arc required
Sample Detection information
1.UV 3D imaging technology fully displaying 3D infrmation of UV glue,analyzing the,analyzing the profile finding inflcting points based on the transformation rate,analysing neighboring information,locating the climbing glue position and controlling the specific the information of climbing glue
2.Precision measurement of trasparent glue height